Sputtering process

Evaporation process

Sputtering provides improved coating quality over evaporation-based processes.

Sputtering is commonly used in semiconductor, compact disc, and DVD applications.

Fast deposition rate

Slow deposition rate

High rate sputtering processes are less susceptible to contamination.

Water or oxygen in a vacuum system contaminates the metal coating, often resulting in coating discoloration or poor adhesion.

Short vulnerability window

Long vulnerability window

Part exposure time during the vulnerability window can be 200 times greater in a typical batch process than with Revolution-3D.

Contamination is a major cause of poor coating quality.  Parts are susceptible to contamination from initial basecoat application until cure of the topcoat.  This “vulnerability window” consists of each painting process, part handling, and metallizer process time.

Small batch, rapid cycle

Large batch, slow cycle.

The metallizing portion of the vulnerability window should be as short as possible.

A batch metallizing cycle can be as long as 30 minutes or more.  Part residence time with the Revolution-3D is less than 15 seconds.

In-line processing

Batch processing

Part storage between processes substantially increases the part vulnerability window.

It may take 2 hours or more for a part to make its way through basecoating, metallizing, and topcoating due to inherent delays arising from batch logistics.  With the Revolution-3D this same time window is only minutes long.

Automated handling.

Manual handling

Manual handling of parts at any time presents the possibility of operator induced contamination from particulate contamination or by accidental mis-handling.

Minimum tooling required.

Large tooling quantities needed

In-line systems have fewest parts in-process.

For a batch system with average throughput of 1 part per second and 2 hour latency time between processes, 7200 extra part tools are needed.

Small footprint

Large footprint

As an integrated component in a conventional coating line, the Revolution-3D takes a minimum of facility space.

1.    Smaller footprint consumes less floor space, enabling more productive use of valuable facility space.

2.    Process region between base coat and top coat must be a clean space.  This space is substantially smaller and lower in cost to build and operate with the Revolution-3D.

Target life – 2 weeks.

Target life – 2 machine cycle.

Lower maintenance effort required.

Result is greater up-time and more parts produced by the line.

Broader material capability

Limited to elemental metals.

The ability to sputter alloys offers varied coating material options.

Provides flexibility for solving specific issues like corrosion or coloration or other application specific situations.